Device for Producing a Metal Strip by Continuous Casting

ABSTRACT

The invention relates to a device for producing a metal strip ( 1 ) by continuous casting, using a casting machine ( 2 ) in which a slab ( 3 ) is cast. At least one milling machine ( 4 ) is arranged in the direction of transport (F) of the slab ( 3 ) behind the casting machine ( 2 ). At least one surface of the slab ( 3 ), preferably two surfaces which are opposite to each other, can be milled in said milling machine. According to the invention, in order to obtain high quality surface machining by milling, in particular in relatively rigid slabs, a shaving conveying device ( 6 ) is arranged in the region of at least one milling cutter ( 5 ) of the milling machine ( 4 ) enabling the milled shavings ( 7 ) to be removed from the region of the milling cutter ( 5 ) in the direction (Q) perpendicular to the direction of transport (F) of the slab ( 3 ).

The invention pertains to a device for producing a metal strip bycontinuous casting, with a casting machine, in which a slab is cast,where at least one milling machine, in which at least one surface of theslab and preferably two opposite surfaces can be milled off, is set updownstream of the casting machine with respect to the transportdirection of the slab.

During the continuous casting of slabs in a continuous casting machine,surface defects such as oscillation marks, casting flux defects, orlongitudinal and transverse surface cracks can form. These occur inconventional and in thin-slab casting machines. Depending on the purposeof the finished strip, parts of the conventional slabs are thereforeflame-descaled. Many slabs are descaled in their entirety at thecustomer's request. The demands on surface quality of thin-slab machinesare continuously increasing.

Suitable methods for processing the surface include flame descaling,grinding, and milling.

Flame descaling suffers from the disadvantage that the flashed-offmaterial has a high oxygen content and therefore must be reprocessedbefore it can be melted down again. In the case of grinding, slivers ofmetal mix with the dust from the grinding wheel, which means that theground-off material must be disposed of. Both methods are difficult toadapt to the given transport speed.

Processing the surface by means of milling therefore seems a logicalchoice. The hot millings are collected, and they can be briquetted andeasily remelted without workup and thus fed back into the productionprocess. The rotational speed of the milling cutter can also be easilyadapted to the transport speed (casting speed, feeding speed into thefinishing). The inventive device of the type indicated above istherefore based on milling.

A device of the type indicated above with a milling machine which is setup downstream of the continuous casting machine is known. Reference ismade in this respect to CH 584 085 and to DE 199 50 886 A1.

A similar device is also disclosed in DE 71 11 221 U1. This documentdescribes the processing of aluminum strip by making use of the castingheat. The machine is connected to the casting installation.

The in-line removal of the top and bottom surfaces or of only onesurface of a thin slab (flame descaling, milling, etc.) just in front ofa rolling train has already been proposed. See EP 1 093 866 A2.

Another embodiment of a surface milling machine is described in DE 19717 200 A1. Among other things, this document deals with theadjustability of the milling contour of the milling device, which is setup downstream of the continuous casting system or upstream of a rollingtrain.

Another arrangement of an in-line milling machine in a conventionalhot-strip mill for treating a near-net strip and its design are proposedin EP 0 790 093 B1, in EP 1 213 076 B1, and in EP 1 213 077 B1.

When the surfaces of thin slabs are treated in a so-called CSP plant,approximately 0.1-3.5 mm of the hot slab surface is removed from one orboth sides in the processing line (“in-line”) as a function of thedetected surface defects. So as not to decrease the output too much, thethin slab should be as thick as possible (H=60-120 mm).

Surface processing and the associated devices are not limited to thinslabs. On the contrary, they can also be used in-line downstream of aconventional thick slab casting system and also in the case of slabswhich are cast in thicknesses ranging from more than 120 mm to 300 mm.

The in-line milling machine is not generally used for all of theproducts of a rolling program but rather only for those in which higherdemands are made on surface quality. This is advantageous for outputreasons, reduces the wear of the milling machine, and is therefore asensible approach.

So that good surface quality will be obtained after the slab is milled,it is important that the milling process, which is usually conducted onboth the top and the bottom surfaces of the slab, take place underfavorable process conditions.

This is no longer the case, however, when there are too many chips inthe area of the milling cutter or cutters. This makes the millingprocess difficult, especially in the area of the top surface of theslab. The chips being cut away here fly off from the tool and fall ontothe surface of the strip.

It is therefore known from DE 101 49 573 A1 and from DE 603 00 800 T2that, to solve this problem, the strip to be process can be turned overso that both sides of the strip can be processed from underneath. On thebottom surface, the chips are removed from the slab automatically, as itwere, by the force of gravity and can be easily collected in a hopperand carted off. This possibility does not exist, however, in the case ofslabs with relatively high intrinsic rigidity. To prevent particles frombeing rolled into the surface, the chips and milling dust must becompletely removed, but this causes problems in the case of rigid slabs.

The present invention is therefore based on the goal of improving adevice for the production of metal strip by continuous casting inassociation with a milling machine in such a way that even intrinsicallyrigid slabs can receive optimal treatment. Measures are to be taken toensure that optimal processing conditions are present during the millingof the slab, preferably both the top and bottom surfaces being treated,so that a high level of slab quality can be obtained.

This goal is achieved by the invention in that, in the area of at leastone milling cutter of the milling machine, a chip conveying device isset up to convey the milled-off chips upward and/or in the directiontransverse to the transport direction of the slab and thus out of thearea of the cutter.

As a result, the slab being processed is kept almost completely free ofchips, which improves the quality of the surface treatment.

The chip conveying device can be designed in various ways.

According to a first embodiment of the invention, the chip conveyingdevice comprises at least one—preferably cooled—guide element, theslab-facing end of which, when viewed in the direction normal to theslab, extends at an acute angle to the direction transverse to thetransport direction. In this case, the transverse conveyance of thechips therefore occurs as a result of the relative movement between thetraveling slab and the guide element just mentioned.

This transverse chip conveyance is especially useful when downcutmilling is practiced, that is, when the transport direction of the slaband the rotational direction of the milling cutter are the same.

Different alternative solutions will preferably be used, however, whenmilling is carried out primarily by the upcut method, that is, when therotational direction of the milling tool and the transport direction ofthe slab are opposite each other. As one alternative, it is thuspossible to use longitudinal spraying and the rotation of the millingtool to throw the chips onto a slanted guide element, along which thechips are then deflected by transverse spraying to the side, where theycan be collected.

The guide element can comprise an edge of heat-resistant material, whichcan be laid against the surface of the slab. The guide element can alsobe supported with the freedom to pivot around a horizontal axistransverse to the transport direction of the slab. It can also beprovided with cooling means or be connected to means by which it can becooled. These cooling means can be designed as spray nozzles, which canspray a coolant onto the guide element.

According to another embodiment, the guide element comprises a troughwith a lateral gradient at the end of the intake channel. By sprayinglongitudinally onto the slab and especially by spraying inside thetransport channel, the chips are carried along by the water orcompressed air and are discharged by way of the guide element and thedischarge chute, optionally with the support of transverse sprayinginside the trough.

In another preferred embodiment, the guide element, i.e., the chipcollecting device, consists of a “water screw”. The chips are conveyedinto this screw by longitudinal water sprays. A suitable orientation ofthe nozzles generates a transverse flow within the screw, from which thechips are ultimately discharged into the lateral discharge channel. Thewater can be applied to the guide element directly, after a deflectionfrom a deflecting plate, or by direct deflection at the nozzle itself.The important point is that the flow is directed at the guide element insuch a way that the chips are carried away.

According to an alternative and preferred embodiment of the invention,the chip conveying device comprises at least one conveyor belt, whichruns transversely to the transport direction in the area of the surfaceof the slab.

In the case of the solution just mentioned, it is preferable for theconveyor belt to run horizontally in the area of the surface of theslab. The conveyor belt can also be designed as an endless belt which,when seen in the transport direction, passes completely around the slab.In this case, it has been found reliable for the conveyor belt to bedeflected around a number of guide pulleys, at least one of which isdriven.

The conveyor belt can be provided with cooling means or be connected tomeans by which it can be cooled. The cooling means are preferablydesigned as spray nozzles, which can spray a coolant onto the conveyorbelt.

According to an alternative embodiment, the chip conveying devicecomprises at least one screw conveyor, which is set up in the area ofthe surface of the slab, and the longitudinal axis of which istransverse to the transport direction. The rotation of the screw makestransverse conveyance of the chips possible. Analogously, therefore, thechips are conveyed in the transverse direction.

In the embodiments of the invention discussed above, a baffle plate canbe set up upstream or downstream of the chip conveying device. Thisbaffle plate can be provided with a number of guide vanes, which facethe milling tool.

The chip conveying device is preferably set up on positioning means, bywhich it can be raised and lowered in the vertical direction. Thus thechip conveying device can be placed at the optimal height with respectto an individual slab.

Instead of the use of a plain milling cutter, it is also possible, as analternative, to use a face cutter, especially for the top surface of theslab. As a result of the rotation of the cutter around a vertical axis,the chips are automatically conveyed to the side without the use ofguide elements. This transverse conveying effect is supported by theactivation of cooling means for the cutting edges.

A guide element for conducting the milled-off chips onto a conveyor beltcan also be provided on the bottom surface of the slab.

A rolling train can be set up downstream of the milling machine.

According to an elaboration, a guide channel is provided, through whichthe chips are drawn by suction from the top surface of the slab directlybehind the milling gap, where the chips are conveyed away through a pipeextending transversely to the transport direction.

Finally, it is also possible to provide at least one magnet, by means ofwhich the chips can be influenced as they are being carried away.

With the proposed solution, it is possible to ensure an optimal millingtreatment and thus to achieve high surface quality without having toturn the slab over, which therefore can have any degree of intrinsicstiffness. This leads to a qualitative improvement in the production ofslabs, especially thin slabs.

Exemplary embodiments of the invention are illustrated in the drawings:

FIG. 1 shows a schematic side view of a device for producing metal stripby continuous casting in association with a milling machine;

FIG. 2 shows a side view of a chip conveying device for the top surfaceof the slab with a conveyor belt, the area of the milling machine beingshown on a larger scale than that of FIG. 1;

FIG. 3 shows a cross section along line A-B of FIG. 2;

FIG. 4 a shows a side view and

FIG. 4 b a top view of an alternative embodiment of the invention with aguide element for the chips set up on the top surface of the slab;

FIG. 5 shows a side view of an embodiment of the invention with a guideelement for the chips set up on the bottom surface of the slab;

FIG. 6 shows a support plate for the slab, set up in the area of themilling cutter;

FIG. 7 shows a side view of a face cutter for the top surface of theslab;

FIG. 8 shows a top view of the face cutter arrangement;

FIG. 9 shows a side view of a chip collecting device for the top surfaceof the slab designed in the form of a “water screw” and a partial topview of same;

FIG. 10 shows a side view of another alternative embodimentcorresponding to FIG. 4 with a trough and an outlet at the end of thecollecting device;

FIG. 11 a shows a side view and

FIG. 11 b a top view of a simple device for conveying chips to the sideby the movement of the slab during downcut milling; and

FIG. 12 shows another alternative embodiment of the invention with asuction device for chips.

FIG. 1 shows a device for producing a metal strip 1 by continuouscasting. The metal strip 1, i.e., the corresponding slab 3, iscontinuously cast in a casting machine 2 by the known method. The slab 3is preferably a thin slab. Immediately downstream of the casting machine2, the slab 3 is subjected to a cleaning process in a cleaning system20. After that, the surface is inspected by means of a surface measuringunit 21. The slab 3 then enters a furnace 22, so that it can be kept atthe desired process temperature. A transverse conveyor 23 follows afterthe furnace.

Downstream of the furnace 22, i.e., of the transverse conveyor 23, theslab 3 arrives at a milling machine 4. In the present case, two millingcutters 5—spaced somewhat apart in the transport direction F—areinstalled, by means of which the bottom and top surfaces of the slab 3can be milled off. A support roll 24 is provided opposite each of theactive cutters to support the surface of the slab 3, i.e., one for thetop surface and one for the bottom surface.

Downstream of the milling machine 4, a descaling spray 35 and a rollingtrain, represented by rolling stands 25 and 26, are installed.

In the present case, the primary goal is to keep the top and bottomsurfaces of the slab as free as possible of the chips which are formedduring the milling process by the milling cutters 5. If the chips arenot removed thoroughly enough from the milling area, the surface of theslab 3 can be damaged. This is especially to be feared in the presentcase, because the slab 3 has such intrinsic stiffness that turning itaround its longitudinal axis so only the downward-facing surface of theslab has to be milled is out of the question.

FIGS. 2 and 3 show a possible embodiment of the invention which cansolve this problem.

As can be seen in FIG. 2, the milling cutter 5 mills off the top surface8 of the slab 3. The slab 3 is supported from underneath by a supportroll 24. As suggested in FIG. 2, the rotational direction of the millingcutter 5 (see arrow) during the milling process causes the chips 7 tofly toward the left in FIG. 2. There is the danger that chips 7remaining on the surface of the slab can interfere with the millingprocess and negatively impact the quality of the treatment.

For this reason, a chip conveying device 6 is provided, which isintended to remove the chips 7 reliably. The chip conveying device 6comprises, as its central component, a conveyor belt 9, as can be easilyseen upon consideration of FIGS. 2 and 3 together. The endless conveyorbelt 9 passes completely around the slab 3 (see FIG. 3). The upper partof the conveyor belt 9 passes just above the surface 8 of the slab 3.

The conveyor belt 9 is guided by four guide pulleys 10, at least one ofwhich is driven. The belt itself consists of heat-stable material,because it comes in contact with the hot slab or passes just barelyabove it. It is therefore advantageous for the conveyor belt 9 to becooled, for which purpose cooling means 11 are provided in thisexemplary embodiment in the form of a spray nozzle. By means of thenozzle 11, a cooling medium (water) can be sprayed onto the conveyorbelt 9 so that it does not become too hot.

So that the chips 7 are not flung too far away from the milling cutter5, a baffle plate 12, which is flat and oriented vertically, is set upbehind the conveyor belt 9.

So that the chips 7 striking the baffle plate 12 are guided optimallyonto the conveyor belt 9, guide vanes 13 are mounted on the side of thebaffle plate 12 facing the milling cutter 5.

The horizontally traveling part of the conveyor belt 9 is intended topass as close as possible to the surface 8 of the slab 3. So that thiscan be adjusted as accurately as possible as a function of the actualslab to be treated, positioning means 14, which are indicated merely inschematic fashion, are provided, by means of which the entire chipconveying device 6 can be adjusted in the vertical direction.

To provide optimal support for the removal of chips from the surface 9of the slab 3, a guide element 15′ (which is used here in conjunctionwith the conveyor belt 9) is also provided in this exemplary embodiment;this guide element could also be called a “stripper”. At the end facingthe slab 3, the guide element 15′ has an edge 16 of especiallyheat-resistant material. During operation, this edge lies either on thesurface of the slab or is held floating just above the surface.

It can also be seen in FIGS. 2 and 3 that, behind the milling cutter 5,there is a nozzle bar 27, consisting of several nozzles (see FIG. 2).With these nozzles, the movement of the chips toward the conveyor belt 9can be supported by means of jets of water or compressed air. Liquid orgaseous medium (water or compressed air), which can also have adesirable cooling effect, can therefore be discharged through thenozzles.

It can be seen in FIG. 3 that the conveyor belt 9 conveys the chips 7onto a second conveyor belt 28, from which the chips 7 are carried intoa collection container 29.

FIG. 9 shows a side view and partial top view of another importantembodiment of the invention. FIG. 9 presents an alternative chipconveying device 6 for the top surface of the slab. By means of a waterjet S, which is applied through a nozzle bar 49, the milled chips areconveyed into a so-called water screw 54. The water can be sprayed fromthe nozzle bar 49 onto a baffle plate 52, where it spreads out and thenflows in direction S toward the guide element 15.

Alternatively, it would also be possible to spray directly from the areaof the baffle plate or to deflect the spray directly at the nozzle sothat it proceeds in the desired direction S.

The goal is for the water jet to pick up the chips and to carry themalong. It is effective to use a pressure of greater than 50 bars. Thewater jet S is not aimed in the direction directly opposite thetransport direction F but instead has a certain component in thetransverse direction, that is, toward the edge of the slab. This isachieved by a suitable angling or turning of the nozzle. The angling canbe symmetric, so that the water flows laterally toward both sides withinthe conveying device 6. It is also possible, however, for the nozzles tobe angled toward only one side (=discharge side).

As a result of the spiral or screw-like shape of the conveying channel54 and the angled orientation of the spray direction 53, a tubular watervortex forms in the area R. As can be seen in the small diagram on theright in FIG. 9, which shows the view from direction B indicated in thediagram on the left in FIG. 9, the high flow velocity and the angledwater feed cause the water 53 carrying the chips to flow in a spiralpattern toward the external discharge channel 51. The discharge channel51 can be located on the drive side and/or on the operator's side, nextto the edge of the slab 3′.

In addition, transverse spraying in the area R, that is, inside the chipconveying device 6, can also support the chip removal process. Chipswhich remain on the top surface of the slab between the guide plate 15and the milling cutter 5 are conveyed onto the guide plate by thelongitudinal spray 27. The chip conveying device 6 lies with its tipdown on the slab or floats just above the slab surface. The guideelement 15 is internally cooled to protect it from the heat or isthermally insulated from the slab 3. It is especially advantageous that,even though water is supplied through the nozzle bar 49 to convey thechips, the slab 3 undergoes hardly any cooling.

FIGS. 4 a and 4 b show two different views of another alternativeembodiment. It should be noted that the guide element 15 shown here canbe used by itself as a chip conveying device 6, or it can be used incombination with a conveyor belt according to FIGS. 2 and 3 (designatedthere as guide element 15′).

In FIGS. 4 a and 4 b, the guide element 15 for conducting the chips 7away is provided on the top surface of the slab 3. The guide element 15is formed out of sheet metal, which is provided at one end 18 with anedge 16 of heat-resistant material. This edge 16—looking in the normaldirection N onto the slab 3 (see FIG. 4 b)—extends at an acute angle αto the direction Q transverse to the transport direction F. The angle ispreferably in the range of 10-45°. The impact surface is also slantedtoward the side.

As a result, the movement or flight of the chips to the plate 15generates a transverse movement in direction Q, so that the chips 7 areflung away toward the side. The chips can fall downward laterally nextto the slab 3, either directly into a collection container or onto aconveyor belt in analogy to the solution according to FIGS. 2 and 3.

The guide element 15 is supported around a horizontal axis 17, whichextends in direction Q, transverse to the transport direction F. Thus—bymeans of positioning means (not shown; see double arrow in FIG. 4 a)—theguide element 15 can be positioned in such a way that the edge 16 eitherrests on the top surface of the slab or is held floating just above it.

The guide element 15 can be cooled by suitable means. Not only is itpossible to cool it by means of spray nozzles from the outside, but itis also conceivable that internal cooling could be provided by means ofappropriate cooling channels in the guide element 15.

In addition to the design as an edge 16 extending at an angle across theentire width of the slab 3, a plow-like design with two edge partsarranged to form an angle α to each other is also possible.

The sideward movement of the chips 7 can also be supported by auxiliarymeans. A blower for air, for example, or a water jet, by means of whichthe chips 7 can be deflected toward the side, would be suitable.High-pressure water or compressed air nozzles 27, 27′, which would beinstalled downstream of the milling cutter 5 or at the side, are alsoconceivable.

In all of the cases illustrated, the guide element 15 can consist of asingle part. It could also consist of several individual segmentsextending across the width of the slab. It can rest by its own weight onthe slab 3. It can also be pressed by spring elements onto the topsurface of the slab. As previously mentioned, it is also possible forthe edge 16 of the guide element 15 to be positioned so that it floatsjust above the top surface of the slab.

The conveyance of the chips in the transverse direction Q can also bepromoted by the milling process itself as a result of the slantedorientation of the cutting edges of the cutter 5.

In the solution according to FIG. 10, as also in the previouslyexplained alternatives, the chips are conveyed by a conveyor jet 27, 49by way of a guide element 15 into the chip conveying device 6. At theend of the device 6, there is here alternatively a discharge chute, intowhich the chips slide or into which they are flushed in the lateraldirection.

To promote the removal of the chips from the top surface of the slab, aface cutter 36 is provided in the solution according to FIGS. 7 and 8instead of the previously described plain milling cutter 5. The cutter36 is located above the slab 3. Cutting edges 37 are attached to theouter area of the bottom surface of the disk-shaped base body. Thediameter of the face cutter 36 is somewhat larger than the maximum widthof the slab. The chips are conveyed to the side 45 by the rotation ofthe cutter 36. Laterally next to the strip, the chips are collected in ahopper 48 and carried away.

So that the slab 3 rests stably in the cutting area of the cutter 36, aninternally cooled transfer table 40 is provided. A driver 38 take careof advancing the slab 3. A cutting edge cooling system 39 takes care ofcooling the face cutter 36 and the cutting edges. By way of a rotarycoupling or drive shaft 44, water or emulsion is supplied to the basebody of the cutter. To ensure optimal cooling of the cutter 36 and topromote the conveyance of the chips to the side, cooling bores 39, whichproceed radially from the center to the cutting edges, are introducedinto the base body. The transverse forces (axial forces) which resultfrom the angled orientation of the cutting edges during the millingprocess are absorbed by lateral roller guides 42. FIG. 7 shows a sideview of the driver and the face cutter on the top surface of the slab 3.FIG. 8 shows a top view of the slab 3 and the face cutter 36 and also ofthe lateral roller guides 42.

FIGS. 11 a and 11 b show the guide element 15 resting on the surface ofthe slab. In the case of downcut milling, therefore, a simple process ofchip conveyance in the sideways direction occurs as a result of theangling a of the lateral surfaces of the guide element 15. As a resultof the relative movement between the traveling slab 3 and the previouslymentioned guide element 15, the chips 7 are carried toward the sidesand, as previously explained, carried onward from there. This mechanismfunctions when the rotational direction 43 of the milling and thetransport direction F of the slab are the same.

In all of the embodiments, it is also possible to use lateral rollerguides 30 (see FIG. 2) to keep the slab 3 centered in the line. Thelateral roller guides 30 can be set up both upstream and downstream ofthe milling machine or of the milling cutters 5.

FIG. 5 shows a guide element 15 for the bottom surface of the slab 3. Itshould be noted that it is obviously much simpler to remove the chips 7from the bottom surface of the slab than from the top surface because itcan be done by gravity. Nevertheless, a guide element 15 is providedhere as well, which can pivot around a horizontal transverse axis 17.Otherwise, the explanations given in conjunction with FIG. 4 apply inanalogous fashion.

The guide element 15 is cooled by cooling means 19 (spray nozzles forwater or nozzles for air). A conveyor belt 9 is provided underneath theguide element 15. The chips 7 being conveyed on this belt can be cooledby cooling means 31 (spray nozzle).

FIG. 6, furthermore, shows a detail which improves the processreliability of the arrangement. Underneath the slab 3, a support plate32 is arranged, which can be internally cooled and raised and lowered.On the opposite side of the slab 3, a movable contact roll 33 is set upto produce a light pressing force. The surface 34 of the support plate32 can be designed with grooves to reduce the contact surface area. Withthe device shown in FIG. 6, the slab can be threaded into the processinggap between the milling cutter 5 and the support roll 24 with optimumresults.

According to another alternative embodiment of the basic idea of theinvention, namely, the removal of chips from the top surface of theslab, use is made of suction. This is illustrated in FIG. 12. For thispurpose, a guide channel consisting of several guide plates 15 is set updirectly downstream of the milling gap. The chips which fly into thechannel are then also drawn by suction and carried away transverselythrough a pipe. The pipe and the suction channel are thermally insulatedfrom the slab. To damp the noise, furthermore, the channel and the pipeare covered externally by damping mats.

To support the conveyance of the chips to the side or to help move thechips in the desired direction, permanent magnets or electromagnets canbe used (not shown). The chips cool down very quickly below thetransformation temperature, which means that they are subject to theinfluence of magnets.

LIST OF REFERENCE SYMBOLS

-   1 metal strip-   2 casting machine-   3 slab-   3′ edge of slab-   3″ center line of slab or machine center-   4 milling machine-   5 milling cutter-   6 chip conveying device-   7 chips-   8 surface of the slab-   9 conveyor belt-   10 guide pulley-   11 cooling means (spray nozzle)-   12 baffle plate-   13 guide vanes-   14 positioning means-   15 guide element-   15′ guide element-   16 edge-   17 axis-   18 end of the guide element-   19 cooling means-   20 cleaning system-   21 surface measuring device-   22 furnace-   23 transverse conveyor-   24 support roll-   25 roll stand-   26 roll stand-   27 nozzle bar for longitudinal spraying-   27′ nozzle bar for transverse spraying-   28 second conveyor belt-   29 collecting container-   30 lateral roller guide-   31 cooling means-   32 support plate-   33 contact roll-   34 surface-   35 descaling spray-   36 face cutter-   37 cutting edge-   38 driver-   39 cutting edge cooling, cutter cooling-   40 transfer table-   41 roller table roller-   42 lateral roller guide-   43 rotational direction-   44 rotary coupling, drive shaft-   45 chip conveyance to the side-   46 milling the top surface-   47 milling the bottom surface-   48 chip collecting hopper-   49 nozzle bar for chip conveyance-   50 roller table roller-   51 discharge channel-   52 deflecting plate or deflection angle-   53 flow direction of the water in the water screw-   54 water screw, chip collecting device-   55 thermal insulation or cooling-   F transport direction-   D rotational direction of the plain milling cutter-   Q transverse direction-   N normal direction-   α angle-   S spray direction-   R area of the tubular water vortex

1. A device for producing a metal strip (1) by continuous casting, witha casting machine (2), in which a slab (3) is cast, where at least onemilling machine (4), in which a least one surface of the slab (3) can bemilled off, is set up downstream of the casting machine (2) with respectto the transport direction (F), wherein, in the area of at least onemilling cutter (5) of the milling machine (4), a chip conveying device(6) is set up, which conveys the milled-off chips (7) upward and/or inthe direction (Q) transverse to the transport direction (F) of the slab(3) out of the area of the milling cutter (5), where the chip conveyingdevice (6) comprises at least one screw conveyor, which is set up in thearea of the surface (8) of the slab (3) and the longitudinal axis ofwhich is transverse to the transport direction (F), or where the chipconveying device (6) comprises at least one guide element (15), the slab(3)-facing end (18) of which, when viewed in the direction (N) normal tothe slab (3), forms an acute angle (a) to the direction (Q) transverseto the transport direction (F), or where the chip conveying device (6)comprises at least one conveyor belt (9), which extends transversely tothe transport direction (F) in the area of the surface (8) of the slab(3).
 2. A device according to claim 1, wherein a trough with a gradientis provided at one of the of the guide element (15).
 3. A deviceaccording to claim 1, wherein the conveyor belt (9) extends horizontallyin the area of the surface (8) of the slab (3).
 4. A device according toclaim 1, wherein the conveyor belt (9) is designed as an endless beltand, when seen in the transport direction (F), passes completely aroundthe slab (3).
 5. A device according to claim 4, wherein the conveyorbelt (9) is deflected over a number of guide pulleys (10), at least oneof which is driven.
 6. A device according to claim 1, wherein theconveyor belt (9) is provided with cooling means (11) or is connected tomeans by which it can be cooled.
 7. A device according to claim 6,wherein the cooling means (11) are designed as spray nozzles, which canspray a cooling medium onto the conveyor belt (9).
 8. A device accordingto claim 1, wherein, with respect to the transport direction (F), abaffle plate (12) is set up upstream or downstream of the chip conveyingdevice (6).
 9. A device according to claim 8, wherein the baffle plate(12) is provided with a number of guide vanes (13), which face themilling cutter (5).
 10. A device according to claim 1, wherein the chipconveying device (6) is set up on positioning means (14), by which itcan be raised or lowered in the vertical direction and/or pivoted.
 11. Adevice according to claim 1, wherein a guide element (15′), by means ofwhich chips (7) can be conducted from the surface (8) of the slab (3)onto the chip conveying device (6), is set up.
 12. A device according toclaim 11, wherein the guide element (15′) comprises an edge (16) ofheat-resistant material, which can be laid against the surface (8) ofthe slab (3).
 13. A device according to claim 11, wherein the guideelement (15′) is pivotably supported around a horizontal axis (17)transverse to the transport direction (F) of the slab (3).
 14. A deviceaccording to claim 11, wherein the guide element (15′) is provided withcooling means (19) or is connected to means by which it can be cooled.15. A device according to claim 14, wherein the cooling means (19) aredesigned as spray nozzles, which can spray a cooling medium onto theguide element (15′).
 16. A device according to claim 1, whereinhigh-pressure water or compressed air nozzles (27, 49) are alsoprovided, which support the transport of the chips.
 17. A deviceaccording to claim 16, wherein the high-pressure water or compressed airnozzles (27, 49) convey chips onto the conveyor belt (9) or to a guideelement (15, 15′) or to a screw-shaped receiving element (54).
 18. Adevice according to claim 1, wherein lateral roller guides (30) areprovided to absorb the axial forces acting on the milling cutter (5).19. A device according to claim 1, wherein milling cutter (5) used atleast for the top surface of the slab is a face cutter (36).
 20. Adevice according to claim 19, wherein several face cutters (36) areprovided, which, when viewed in the transport direction (F), arearranged to overlap.
 21. A device according to claim 19, wherein theface cutter (36) comprises a number of cutting edges (37), which can becooled by a cutting edge cooling system (39).
 22. A device according toclaim 1, wherein a transfer table (40) is provided, which is designed sothat the slab (3) can rest on it in the area of the milling cutter orcutters (5).
 23. A device according to claim 22, wherein the transfertable (40) is designed with internal cooling.
 24. A device according toclaim 1, wherein the chip conveying device (6) is designed as ascrew-shaped receiving element (54).
 25. A device according to claim 24,wherein a guide element (15) is provided, which is designed to conveychips from the top surface of the slab into the receiving element (54)designed with a screw-like shape.
 26. A device according to claim 24,wherein a deflecting plate (52) is provided, where the deflecting plate(52) can be sprayed with a jet of transport water discharged from anozzle bar (49).
 27. A device according to claim 1, wherein a guidechannel is provided, through which the chips are drawn by suction fromthe top surface of the slab directly behind the milling gap, where thechips are transported away through a pipe transverse to the transportdirection (F).
 28. A device according to claim 1, wherein at least onemagnet is set up, by means of which the chips can be influenced as theyare being carried away.